DocumentCode :
1449340
Title :
A Quadratic Eigenvalue Solver of Linear Complexity for 3-D Electromagnetics-Based Analysis of Large-Scale Integrated Circuits
Author :
Lee, Jongwon ; Chen, Duo ; Balakrishnan, Venkataramanan ; Koh, Cheng-Kok ; Jiao, Dan
Author_Institution :
Agency for Defense Dev., Daejeon, South Korea
Volume :
31
Issue :
3
fYear :
2012
fDate :
3/1/2012 12:00:00 AM
Firstpage :
380
Lastpage :
390
Abstract :
It is of critical importance to efficiently and accurately predict global resonances of a 3-D integrated circuit system that involves arbitrarily shaped lossy conductors and inhomogeneous materials. A quadratic eigenvalue solver of linear complexity and electromagnetic accuracy is developed in this paper to fulfill this task. Without sacrificing accuracy, the proposed eigenvalue solver has shown a clear advantage over state-of-the-art eigenvalue solvers in fast CPU time. It successfully solves a quadratic eigenvalue problem of over 2.5 million unknowns associated with a large-scale 3-D on-chip circuit embedded in inhomogeneous materials in 40 min on a single 3 GHz 8222SE AMD Opteron processor.
Keywords :
circuit complexity; circuit resonance; eigenvalues and eigenfunctions; inhomogeneous media; large scale integration; three-dimensional integrated circuits; 3D electromagnetics-based analysis; 3D integrated circuit system; AMD Opteron processor; CPU time; arbitrarily shaped lossy conductors; electromagnetic accuracy; global resonances; inhomogeneous materials; large-scale 3D on-chip circuit; large-scale integrated circuits; linear complexity; quadratic eigenvalue problem; quadratic eigenvalue solver; state-of-the-art eigenvalue solvers; Accuracy; Complexity theory; Eigenvalues and eigenfunctions; Integrated circuits; Resonant frequency; Sparse matrices; Vectors; Arnoldi iteration; fast solvers; finite element methods; full-wave analysis; integrated circuits; quadratic eigenvalue problem; resonance analysis;
fLanguage :
English
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
0278-0070
Type :
jour
DOI :
10.1109/TCAD.2011.2170989
Filename :
6152776
Link To Document :
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