Title :
Review of On-Chip Inductor Structures With Magnetic Films
Author :
Gardner, Donald S. ; Schrom, Gerhard ; Paillet, Fabrice ; Jamieson, Brice ; Karnik, Tanay ; Borkar, Shekhar
Author_Institution :
Intel Res., Santa Clara, CA, USA
Abstract :
A comparison of on-chip inductors with magnetic materials from previous studies is presented and examined. Results from on-chip inductors with magnetic material integrated into a 90 nm CMOS processes are presented. The inductors use copper metallization and amorphous Co-Zr-Ta magnetic material. Inductance densities of up to 1700 nH/mm2 were obtained thanks to inductance increases of up to 31 times, significantly greater than previously published on-chip inductors. With such improvements, the effects of eddy currents, skin effect, and proximity effect become clearly visible at higher frequencies. Co-Zr-Ta was chosen for its good combination of high permeability, good stability at high temperature (> 250degC), high saturation magnetization, low magnetostriction, high resistivity, minimal hysteretic loss, and compatibility with silicon technology. The Co-Zr-Ta alloy can operate at frequencies up to 9.8 GHz, but trade-offs exist between frequency, inductance, and quality factor. Our inductors with thick copper and thicker magnetic films have dc resistances as low as 0.04 Omega, and quality factors of up to 8 at frequencies as low as 40 MHz.
Keywords :
CMOS integrated circuits; amorphous magnetic materials; copper compounds; eddy currents; inductance; magnetic thin films; magnetisation; magnetostriction; reviews; semiconductor thin films; skin effect; thin film inductors; zirconium compounds; CMOS processes; CoZrTa; amorphous magnetic material; copper metallization; eddy currents; hysteretic loss; magnetic films; magnetostriction; onchip inductor; proximity effect; quality factor; saturation magnetization; size 90 nm; skin effect; Amorphous magnetic films; inductors; permeability; soft magnetic materials; thin film inductors;
Journal_Title :
Magnetics, IEEE Transactions on
DOI :
10.1109/TMAG.2009.2030590