DocumentCode :
1452017
Title :
SDX: a novel self-aligned technique and its application to high-speed bipolar LSIs
Author :
Yamamoto, Yousuke ; Sakuma, Kazuhito
Author_Institution :
LSI Lab., NTT, Kanagawa, Japan
Volume :
35
Issue :
10
fYear :
1988
fDate :
10/1/1988 12:00:00 AM
Firstpage :
1601
Lastpage :
1608
Abstract :
A novel polysilicon selective-deposition method named selective deposition by exdiffusion (SDX) and a self-aligned bipolar LSI process using the SDX process are presented. The SDX process makes it possible to selectively form polysilicon patterns on silicon oxide patterns but not on silicon nitride patterns, where these patterns are formed on a silicon substrate surface. Bipolar transistor self-alignment between the isolation pattern and the entire transistor active region can be achieved in a 0.85-μm silicon island by the SDX process. A transistor with a 12-GHz cutoff frequency, an LCML gate with a propagation delay time of 59 ps/gate, and a 1-kb ECL (emitter-coupled logic) memory with an access time of 0.95 ns have been achieved
Keywords :
bipolar integrated circuits; emitter-coupled logic; integrated circuit technology; large scale integration; 0.85 micron; 0.95 ns; 12 GHz; ECL; LCML gate; SDX process; Si; Si-SiO2; access time; exdiffusion; high-speed bipolar LSIs; memory; propagation delay time; selective deposition; self-aligned technique; self-alignment; Acceleration; Bipolar transistors; Capacitance; Cutoff frequency; Large scale integration; Propagation delay; Semiconductor films; Silicon; Space technology; Substrates;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.7360
Filename :
7360
Link To Document :
بازگشت