DocumentCode :
1452453
Title :
Significance of coating stress on substrate bow in large area processing of MCM
Author :
Yang, Kwanho ; Im, Jang-Hi ; Heistand, Robert H.
Author_Institution :
Mater. Res. & Synthesis, Dow Chem. Co., Midland, MI, USA
Volume :
24
Issue :
1
fYear :
2001
fDate :
2/1/2001 12:00:00 AM
Firstpage :
33
Lastpage :
36
Abstract :
The substrate bow in a large area processing (LAP) was simulated using a finite element analysis (FEA). The structures considered were aluminum (Al) and glass substrates of various thicknesses, and a coating from Photosensitive film thickness. It was found that the deflection of a large area substrate, e.g., 400 mm2, could not always be obtained from the linear, small deflection theory even if the curvature might be small and the stress-strain behavior in the linear elastic regime. In this case, the nonlinear, large deflection theory had to be adopted. Also, the gravity effect from the substrate weight turned out to be very significant and had to be incorporated as well. The simulation incorporating these two factors agreed well with the experimental data, which was generated by spin coating and curing the BCB formulation on Al substrates, 400×400×1.27 mm. As a means of flattening out the curvature, subjecting a vacuum underneath the substrate was simulated. Significant reduction of the substrate deflection was observed by applying only a very small vacuum. This result suggested that the use of double-stick tape on the bottom of the substrate, for example, might also of feasible to completely eliminate the bow
Keywords :
finite element analysis; internal stresses; multichip modules; spin coating; substrates; Al; BCB coating stress; MCM; aluminum substrate; curing; curvature; double-stick tape; finite element analysis; glass substrate; gravity effect; large area processing; large deflection analysis; numerical simulation; photosensitive film; small deflection analysis; spin coating; substrate bow; vacuum assisted flattening; Analytical models; Chemicals; Coatings; Finite element methods; Gravity; Laboratories; Production; Residual stresses; Substrates; Temperature;
fLanguage :
English
Journal_Title :
Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3323
Type :
jour
DOI :
10.1109/6040.909622
Filename :
909622
Link To Document :
بازگشت