• DocumentCode
    1452461
  • Title

    Development of microwave multilayer plastic-based multichip modules

  • Author

    Pham, Anh-Vu H. ; Sutono, Albert ; Laskar, Joy ; Krishnamurthy, V. ; Lester, D. ; Balch, E. ; Rose, J.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Clemson Univ., SC, USA
  • Volume
    24
  • Issue
    1
  • fYear
    2001
  • fDate
    2/1/2001 12:00:00 AM
  • Firstpage
    37
  • Lastpage
    40
  • Abstract
    We present the design and development of multilayer plastic-based multichip modules (MCM) at microwave frequencies. A vertical feed-through interconnect, which consists of embedded copper wires in plastic, has been developed to transport RF/microwave and dc signals from the first to the second packaging level. The development of this vertical feed-through enables plastic modules to be configured in a surface mount topology that can be interfaced with low cost FR-4 boards using ball grid arrays (BGA). The experimental analysis results demonstrate that this vertical feed-through used with BGAs has ultra-low parasitics and achieves a return loss of greater than 20-dB at 4-GHz. In addition, we demonstrate a number of packaged active microwave circuits including a switch, a low noise amplifier (LNA) and a power amplifier using the plastic module technology at microwave frequencies
  • Keywords
    MMIC; ball grid arrays; integrated circuit interconnections; integrated circuit packaging; multichip modules; multilayers; plastic packaging; surface mount technology; 20 dB; 4 GHz; Cu; FR-4 board; active microwave circuit; ball grid array; embedded copper wire; low noise amplifier; microwave multilayer plastic multichip module; packaging; parasitics; power amplifier; return loss; surface mount topology; switch; vertical feedthrough interconnect; Copper; Integrated circuit interconnections; Low-noise amplifiers; Microwave amplifiers; Microwave frequencies; Multichip modules; Nonhomogeneous media; Plastic packaging; Switches; Wires;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/6040.909623
  • Filename
    909623