DocumentCode
1452478
Title
A novel high speed multitap bus structure
Author
Barber, V. Alan ; Lee, Keunmyung ; Obermaier, Hannsjörg
Author_Institution
Hewlett-Packard Co., Palo Alto, CA, USA
Volume
24
Issue
1
fYear
2001
fDate
2/1/2001 12:00:00 AM
Firstpage
54
Lastpage
59
Abstract
Reducing reflections, noise, and settling time on a bus through unique selections of node terminations, bus characteristic impedance, and bus construction allows dramatically higher operating speed. The new structure is described, the theory discussed, and results from fully operational physical and electrical implementations are presented
Keywords
high-speed integrated circuits; integrated circuit interconnections; packaging; system buses; bus characteristic impedance; bus construction; electrical implementations; high speed multitap bus structure; node terminations; noise; operating speed; reflections; settling time; Acoustic reflection; Bandwidth; Clocks; Distributed parameter circuits; Driver circuits; Impedance; Integrated circuit interconnections; Power transmission lines; System performance; Transmission line theory;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/6040.909625
Filename
909625
Link To Document