• DocumentCode
    1452503
  • Title

    Post-weld-shift in dual-in-line laser package

  • Author

    Kuang, Jao-Hwa ; Sheen, Maw-Tyan ; Wang, Szu-Chun ; Wang, Gow-Ling ; Cheng, Wood-Hi

  • Author_Institution
    Dept. of Mech. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
  • Volume
    24
  • Issue
    1
  • fYear
    2001
  • fDate
    2/1/2001 12:00:00 AM
  • Firstpage
    81
  • Lastpage
    85
  • Abstract
    The post-weld-shift (PWS) effect in laser welding for a dual-in-line package (DIP) with fiber pigtail to semiconductor laser connection has been studied experimentally and numerically. Experimental results show that the PWS of an optical component welded by a dual-beam laser system deforms and the welded component rotates counterclockwise as the difference of the energies between two laser beams increases. This indicates that the PWS in laser packaging can be minimized by properly controlling the laser beam-to-beam energy balance. A thermal-plasticity coupled finite-element model (FEM) has been also carried out on the analysis of the effect of PWS in laser packaging. Numerical results show that a PWS in the DIP may be introduced from an unbalanced distribution of residual stresses introduced from the solidification shrinkage. A satisfactory agreement between the experimental results and FEM calculations suggests that the FEM may provide an effective method for predicting the PWS in laser welding technique for optoelectronic packaging
  • Keywords
    finite element analysis; internal stresses; laser beam welding; semiconductor device packaging; semiconductor lasers; DIP; dual-beam laser system; dual-in-line laser package; fiber pigtail to semiconductor laser connection; laser beam-to-beam energy balance; laser packaging; laser welding; optoelectronic packaging; post-weld-shift; residual stresses; solidification shrinkage; thermal-plasticity coupled finite-element model; Electronics packaging; Fiber lasers; Laser beams; Laser modes; Optical control; Optical coupling; Optical devices; Semiconductor device packaging; Semiconductor lasers; Welding;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/6040.909629
  • Filename
    909629