• DocumentCode
    145258
  • Title

    Quantitative analysis of emotionally expressive language for personalized service

  • Author

    Il-Kyoung Kwon ; Sang-Yong Lee

  • Author_Institution
    Dept. of Comput. Sci. & Eng., Kongju Nat. Univ., Cheonan, South Korea
  • Volume
    1
  • fYear
    2014
  • fDate
    26-28 April 2014
  • Firstpage
    508
  • Lastpage
    512
  • Abstract
    Researches on personalization services with context awareness under a mobile environment are being conducted actively. Majority of them focus on user profile-based learning which is in need of personalization or context-awareness-based reasoning technique and does not cover the emotional aspect of users. In order to sense emotion information, which may not easily be sensed from users, this research analyzed the tendency of positive/negative aspects of emotional expressive language, which was sorted from a psychological emotion model using AHP. Interrelationship analysis and matching between certain emotional expressive language and cognized context were performed as well. A survey was carried out among 100 persons in their early 20s and the result of the survey was analyzed via AHP. 91.6% of the test group showed that there was strong interrelation between certain context information and positive emotion expressive language. Therefore, an emotional personalization service that uses universal emotion expressive language may be provided for accurate context awareness to be performed.
  • Keywords
    analytic hierarchy process; inference mechanisms; mobile computing; psychology; AHP; cognized context; context-awareness-based reasoning technique; emotional expressive language; emotional personalization service; interrelationship analysis; mobile environment; psychological emotion model; quantitative analysis; user profile-based learning; Analytic hierarchy process; Analytical models; Context; Context modeling; Mobile communication; Psychology; Sensitivity analysis; AHP; Analytic Hierarchy Process; Emotional Expression; Emotional Modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Information Science, Electronics and Electrical Engineering (ISEEE), 2014 International Conference on
  • Conference_Location
    Sapporo
  • Print_ISBN
    978-1-4799-3196-5
  • Type

    conf

  • DOI
    10.1109/InfoSEEE.2014.6948164
  • Filename
    6948164