DocumentCode
145258
Title
Quantitative analysis of emotionally expressive language for personalized service
Author
Il-Kyoung Kwon ; Sang-Yong Lee
Author_Institution
Dept. of Comput. Sci. & Eng., Kongju Nat. Univ., Cheonan, South Korea
Volume
1
fYear
2014
fDate
26-28 April 2014
Firstpage
508
Lastpage
512
Abstract
Researches on personalization services with context awareness under a mobile environment are being conducted actively. Majority of them focus on user profile-based learning which is in need of personalization or context-awareness-based reasoning technique and does not cover the emotional aspect of users. In order to sense emotion information, which may not easily be sensed from users, this research analyzed the tendency of positive/negative aspects of emotional expressive language, which was sorted from a psychological emotion model using AHP. Interrelationship analysis and matching between certain emotional expressive language and cognized context were performed as well. A survey was carried out among 100 persons in their early 20s and the result of the survey was analyzed via AHP. 91.6% of the test group showed that there was strong interrelation between certain context information and positive emotion expressive language. Therefore, an emotional personalization service that uses universal emotion expressive language may be provided for accurate context awareness to be performed.
Keywords
analytic hierarchy process; inference mechanisms; mobile computing; psychology; AHP; cognized context; context-awareness-based reasoning technique; emotional expressive language; emotional personalization service; interrelationship analysis; mobile environment; psychological emotion model; quantitative analysis; user profile-based learning; Analytic hierarchy process; Analytical models; Context; Context modeling; Mobile communication; Psychology; Sensitivity analysis; AHP; Analytic Hierarchy Process; Emotional Expression; Emotional Modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Information Science, Electronics and Electrical Engineering (ISEEE), 2014 International Conference on
Conference_Location
Sapporo
Print_ISBN
978-1-4799-3196-5
Type
conf
DOI
10.1109/InfoSEEE.2014.6948164
Filename
6948164
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