Buried-mesa avalanche photodiodes

We have developed a low-cost buried-mesa avalanche photodiode (APD) primarily targeted for 2.5-Gb/s lightwave applications. These APDs are made by a simple batch process that produces a robust and reliable device with potentially high yield and thus low cost. The entire base structure of our InGaAs-InP APD is grown in one epitaxial step and the remaining process consists of four simple steps including a mesa etch, one epitaxial overgrowth, isolation, and metallization. Buried-mesa APDs fabricated in this way show high uniform gain that rises smoothly to breakdown with increasing reverse bias. When biased to operate at a gain of 10, these unoptimized devices show dark current less than 20 nA, excess noise factor less than 5, and a 3-dB bandwidth of about 4 GHz. With a 1550-nm laser modulated at 2488 Mb/s, a maximum sensitivity of -327 dBm was obtained with an optical receiver using one such APD, without antireflection coatings. These APD´s not only demonstrate excellent device characteristics but also high reliability under rigorous stress testing. No degradation was observed even after being biased near breakdown for over 2000 h at 200°C