DocumentCode :
1453253
Title :
A matrix synthesis approach to thermal placement
Author :
Chu, Chris C N ; Wong, D.F.
Author_Institution :
Dept. of Comput. Sci., Texas Univ., Austin, TX, USA
Volume :
17
Issue :
11
fYear :
1998
fDate :
11/1/1998 12:00:00 AM
Firstpage :
1166
Lastpage :
1174
Abstract :
In this paper, we consider the thermal placement problem for gate arrays. We introduce a new combinatorial optimization problem, matrix synthesis problem (MSP), to model the thermal placement problem. Given a list of mn nonnegative real numbers and an integer t, MSP constructs a m×n matrix out of the given numbers such that the maximum sum among all t×t submatrices is minimized. We show that MSP is NP-complete and present several provably good approximation algorithms for the problem. We also demonstrate that our thermal placement strategy is flexible enough to allow simultaneous consideration of other objectives such as wiring
Keywords :
VLSI; circuit optimisation; integrated circuit layout; integrated circuit packaging; integrated circuit reliability; logic CAD; logic arrays; wiring; NP-complete; combinatorial optimization problem; matrix synthesis approach; matrix synthesis problem; nonnegative real numbers; provably good approximation algorithms; thermal placement; wiring; Approximation algorithms; Bandwidth; Circuits; Clocks; Energy consumption; Frequency; Packaging; Transmission line matrix methods; Very large scale integration; Wiring;
fLanguage :
English
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
0278-0070
Type :
jour
DOI :
10.1109/43.736189
Filename :
736189
Link To Document :
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