DocumentCode :
1453323
Title :
Megaelectronvolt phosphorus implantation for bipolar devices
Author :
Böhm, Hans-joachim ; Bernewitz, Lore ; Böhm, Willi R. ; Köpl, Rupert
Author_Institution :
Siemens AG, Munich, West Germany
Volume :
35
Issue :
10
fYear :
1988
fDate :
10/1/1988 12:00:00 AM
Firstpage :
1616
Lastpage :
1619
Abstract :
The use of megaelectronvolt phosphorus implantation in the formation of the buried layer of bipolar transistors was investigated. The main focus was on the reduction of the secondary defect density. The lowest defect density is obtained with annealing by rapid thermal processing (1150°C/60 s). Results on electrical characteristics of bipolar transistors with megaelectronvolt-implanted buried layers are presented and compared with those of conventional devices
Keywords :
annealing; bipolar transistors; ion implantation; 1150 degC; 60 s; P; annealing; bipolar devices; bipolar transistors; buried layer; electrical characteristics; megaelectronvolt implantation; rapid thermal processing; secondary defect density; BiCMOS integrated circuits; Bipolar transistors; Conductivity; Electric variables; Epitaxial layers; Heat treatment; Ion implantation; Rapid thermal annealing; Rapid thermal processing; Surface resistance;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.7362
Filename :
7362
Link To Document :
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