DocumentCode :
1453340
Title :
On-Wafer S-Parameter Measurements in the 325–508 GHz Band
Author :
Fung, Andy ; Samoska, Lorene ; Pukala, David ; Dawson, Douglas ; Kangaslahti, Pekka ; Varonen, Mikko ; Gaier, Todd ; Lawrence, Charles ; Boll, Greg ; Lai, Richard ; Mei, X.B.
Author_Institution :
Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
Volume :
2
Issue :
2
fYear :
2012
fDate :
3/1/2012 12:00:00 AM
Firstpage :
186
Lastpage :
192
Abstract :
We report on two-port on-wafer vector network analyzer measurements in the 325-508 GHz frequency band. Measurements are made with prototype GGB Industries Inc. WR2.2 (325-500 GHz) coplanar waveguide probes and OML Inc. WR2.2 frequency extenders. New probe performance data and characteristics of probe tip calibration using a Thru-Reflect-Line procedure are discussed. Probe S-parameter measurements indicate insertion loss per probe of 5.0 to 9.1 dB in the WR2.2 band. Calibrated dynamic range of about 30 dB or better for insertion and return loss measurement across the band is achieved. These new results for the prototype WR2.2 probes, the calibration procedure, observed errors, and results of on-wafer amplifier measurements are presented.
Keywords :
MMIC; S-parameters; coplanar waveguides; millimetre wave measurement; network analysers; probes; WR2.2 coplanar waveguide probes; WR2.2 frequency extender; calibration procedure; frequency 325 GHz to 508 GHz; insertion loss; monolithic microwave integrated circuit; on-wafer S-parameter measurement; on-wafer amplifier measurement; probe S-parameter measurement; probe performance data; probe tip calibration; submillimeter wave; thru-reflect-line procedure; two-port on-wafer vector network analyzer measurement; Calibration; Frequency measurement; Insertion loss; Loss measurement; Probes; Scattering parameters; Transmission line measurements; Millimeter wave; S-parameters; monolithic microwave integrated circuits (MMIC); on-wafer; submillimeter wave; terahertz (THz);
fLanguage :
English
Journal_Title :
Terahertz Science and Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-342X
Type :
jour
DOI :
10.1109/TTHZ.2011.2182369
Filename :
6155631
Link To Document :
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