• DocumentCode
    1454252
  • Title

    Fabrication of planar nanofluidic channels in thermoplastic polymers by O2 plasma etching

  • Author

    Junshan Liu ; Hongchao Qiao ; Zheng Xu ; Chong Liu ; Junyao Wang ; Liqun Du ; Xi Zhang ; Liding Wang

  • Author_Institution
    Key Lab. for Precision & Non-traditional Machining Technol., Dalian Univ. of Technol., Dalian, China
  • Volume
    7
  • Issue
    2
  • fYear
    2012
  • Firstpage
    159
  • Lastpage
    162
  • Abstract
    A simple O2 plasma etching method is developed and first used to fabricate planar nanofluidic channels in thermoplastic polymers. In this process, a copper etching mask with a micron-scale width is made by traditional UV lithography and wet etching on a polymer substrate, then the polymer substrate is etched by O2 plasma in a commonly used plasma cleaner to form the planar nanochannel. Effects of the process parameters of the plasma cleaner on the etching rate are studied. The average etching rate for most thermoplastic polymers used in lab-on-a-chip is about 10 nm/min and the surface roughness is less than 2 nm when radio frequency power and chamber pressure are 60 W and 200 Pa, respectively. To demonstrate this method, a polymethylmethacrylate (PMMA) micro-nanofluidic chip containing nine parallel nanochannels, 100 nm in depth, 5 μm wide and 1 mm long, is fabricated to investigate the ion enrichment of 1 M fluorescein isothiocyanate (FITC) in 10 mM phosphate buffered saline (PBS) buffer.
  • Keywords
    copper; lab-on-a-chip; masks; microfabrication; microfluidics; nanofabrication; nanofluidics; polymers; sputter etching; surface roughness; ultraviolet lithography; Cu; O2 plasma etching; UV lithography; chamber pressure; copper etching mask; etching rate; fluorescein isothiocyanate; lab-on-a-chip; phosphate buffered saline buffer; planar nanofluidic channel; plasma cleaner; polymer substrate; polymethylmethacrylate micro-nanofluidic chip; power 60 W; pressure 200 Pa; radio frequency power; surface roughness; thermoplastic polymers; wet etching;
  • fLanguage
    English
  • Journal_Title
    Micro & Nano Letters, IET
  • Publisher
    iet
  • ISSN
    1750-0443
  • Type

    jour

  • DOI
    10.1049/mnl.2011.0651
  • Filename
    6156043