Study on effect of coupling agents on underfill material in flip chip packaging

Author

Luo, Shijian ; Wong, C.P.

Author_Institution

Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA

Volume

24

Issue

1

fYear

2001

fDate

3/1/2001 12:00:00 AM

Firstpage

38

Lastpage

42

Abstract

Coupling agents are widely used in order to improve the adhesion property of underfill. In this study, three different silane coupling agents, two titanate coupling agents, and one zirconate coupling agent were added into an epoxy underfill material. Their effects on the flow behavior and curing profile of the epoxy underfill were studied with a rheometer and a differential scanning calorimeter, respectively. The thermal stability of the cured underfill material was studied with a thermogravimetric analyzer. A thermal mechanical analyzer and a dynamic mechanical analyzer were used to measure the coefficient of thermal expansion, the glass transition temperature (T_g), and the storage modulus (E´). In addition, the adhesion of the underfill on benzocyclobutene passivated silicon die and polyimide passivated silicon die was measured through die shear test. The effects of aging in an 85°C/85% relative humidity chamber were also studied through moisture absorption test and die shear test

Keywords

adhesion; adhesives; chip-on-board packaging; differential scanning calorimetry; elastic moduli; encapsulation; flip-chip devices; glass transition; passivation; shear strength; thermal expansion; thermal stability; 85 C; BCB passivated silicon die; DSC; TGA; adhesion property; aging effects; coefficient of thermal expansion; coupling agents effect; curing profile; die shear test; dynamic mechanical analysis; encapsulant adhesive; epoxy underfill; flip chip packaging; flow behavior; glass transition temperature; humidity chamber; moisture absorption test; polyimide passivated silicon die; silane coupling agents; storage modulus; thermal mechanical analysis; thermal stability; titanate coupling agents; underfill material; zirconate coupling agent; Adhesives; Curing; Glass; Mechanical variables measurement; Silicon; Stability analysis; Testing; Thermal expansion; Thermal stability; Titanium compounds;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/6144.910800

Filename

910800