Title :
Vertical-cavity surface-emitting lasers flip-chip bonded to gigabit-per-second CMOS circuits
Author :
Krishnamoorthy, A.V. ; Chirovsky, L.M.F. ; Hobson, W.S. ; Leibengath, R.E. ; Hui, S.P. ; Zydzik, G.J. ; Goossen, K.W. ; Wynn, J.D. ; Tseng, B.J. ; Lopata, J. ; Walker, J.A. ; Cunningham, J.E. ; D´Asaro, L.A.
Author_Institution :
Bell Labs., Lucent Technol., Holmdel, NJ, USA
Abstract :
We describe the first integration of vertical-cavity surface-emitting laser arrays with gigabit-per-second CMOS circuits via flip-chip bonding.
Keywords :
CMOS integrated circuits; flip-chip devices; integrated optoelectronics; optical interconnections; semiconductor laser arrays; surface emitting lasers; CMOS integrated circuits; IOE; VLSI; flip-chip bonded; flip-chip bonding; gigabit-per-second CMOS circuits; vertical-cavity surface-emitting laser arrays; vertical-cavity surface-emitting lasers; Bonding; CMOS technology; Circuit testing; Gallium arsenide; Integrated circuit technology; Optical arrays; Optical interconnections; Surface emitting lasers; Vertical cavity surface emitting lasers; Very large scale integration;
Journal_Title :
Photonics Technology Letters, IEEE
