DocumentCode
1455445
Title
Modeling via hole grounds in microstrip
Author
Goldfarb, Marc E. ; Puce, Robert A.
Author_Institution
Raytheon Inc., Lexington, MA, USA
Volume
1
Issue
6
fYear
1991
fDate
6/1/1991 12:00:00 AM
Firstpage
135
Lastpage
137
Abstract
A simple model for a cylindrical via hole in a microstrip is presented. The model is based on a modification of the inductance of a cylindrical conductor as derived from Maxwell´s equations. The model was verified experimentally, and is corroborated by other solutions using numerical techniques.<>
Keywords
inductance; modelling; strip lines; Maxwell´s equations; cylindrical conductor; cylindrical via hole; inductance; microstrip; model; via hole grounds; Conductors; Foundries; Inductance measurement; Maxwell equations; Metallization; Microstrip components; Moment methods; Numerical simulation; Springs; Topology;
fLanguage
English
Journal_Title
Microwave and Guided Wave Letters, IEEE
Publisher
ieee
ISSN
1051-8207
Type
jour
DOI
10.1109/75.91090
Filename
91090
Link To Document