• DocumentCode
    1455610
  • Title

    Fabrication of high-aspect-ratio ceramic microstructures by injection molding with the altered lost mold technique

  • Author

    Chen, Ren-Haw ; Lan, Chih-Lung

  • Author_Institution
    Dept. of Mech. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
  • Volume
    10
  • Issue
    1
  • fYear
    2001
  • fDate
    3/1/2001 12:00:00 AM
  • Firstpage
    62
  • Lastpage
    68
  • Abstract
    A fabrication process for complex ceramic microstructures was proposed that combines a lost mold technique and ceramic injection molding. Two key points in this process were studied. First, the solubility of several engineering plastics in various organic solvents was tested to find appropriate combinations of mold material and solvent for dissolving molds. Secondly, the binder extraction rate and the strength of a green body during debinding were investigated. Experimental results indicate that acrylonitrile-butadiene styrene and acetone are the best combinations selected for this lost mold technique. We also propose that using gasoline as the debinding solvent and performing the debinding at room temperature will give a good time-saving effect and avoid toppling the microstructure if paraffin wax, stearic acid, and polyethylene were selected to compound the binder system. This process has been successfully applied to fabricate several ceramic microstructures, such as an integrated punch
  • Keywords
    ceramics; dissolving; micromechanical devices; moulding; acetone; acrylonitrile-butadiene styrene; altered lost mold technique; aspect ratio; binder extraction rate; ceramic microstructures; debinding; dissolving; engineering plastics; gasoline; green body; injection molding; mold material; Ceramics; Fabrication; Injection molding; Materials testing; Microstructure; Organic materials; Petroleum; Plastics; Solvents; Temperature;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/84.911093
  • Filename
    911093