DocumentCode
1455617
Title
A robust co-sputtering fabrication procedure for TiNi shape memory alloys for MEMS
Author
Shih, Chen-Luen ; Lai, Bo-Kuai ; Kahn, Harold ; Phillips, Stephen M. ; Heuer, Arthur H.
Author_Institution
Dept. of Mater. Sci. & Eng., Case Western Reserve Univ., Cleveland, OH, USA
Volume
10
Issue
1
fYear
2001
fDate
3/1/2001 12:00:00 AM
Firstpage
69
Lastpage
79
Abstract
Co-sputtering has been used to fabricate equiatomic thin films of TiNi, a shape memory alloy which form the basis of microactuators with many applications in MEMS. Methods for overcoming the difficulties involved in obtaining equiatomic TiNi thin films with high transformation temperatures, and a robust procedure suitable for batch fabrication in a production environment, are described
Keywords
batch processing (industrial); microactuators; nickel alloys; shape memory effects; sputter deposition; titanium alloys; MEMS; TiNi; batch fabrication; co-sputtering fabrication procedure; equiatomic thin films; microactuators; production environment; shape memory alloys; transformation temperatures; Fabrication; Micromechanical devices; Production; Robustness; Shape memory alloys; Sputtering; Substrates; Temperature distribution; Temperature sensors; Transistors;
fLanguage
English
Journal_Title
Microelectromechanical Systems, Journal of
Publisher
ieee
ISSN
1057-7157
Type
jour
DOI
10.1109/84.911094
Filename
911094
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