• DocumentCode
    1455641
  • Title

    Fabrication of metallic heat exchangers using sacrificial polymer mandrils

  • Author

    Arias, Francisco ; Oliver, Scott R J ; Xu, Bing ; Holmlin, R. Erik ; Whitesides, George M.

  • Author_Institution
    Dept. of Chem., Harvard Univ., Cambridge, MA, USA
  • Volume
    10
  • Issue
    1
  • fYear
    2001
  • fDate
    3/1/2001 12:00:00 AM
  • Firstpage
    107
  • Lastpage
    112
  • Abstract
    This paper demonstrates the use of poly(dimethylsiloxane) (PDMS), polyurethane (PU), epoxy, and poly(methyl methacrylate) (PMMA) as mandrils to fabricate metallic heat exchangers having 300-700 μm internal channels. The mandrils were prepared using two soft lithographic techniques-replica molding and microembossing. To fabricate the heat exchangers, the polymeric mandrils were coated with a thin layer of metal by thermal evaporation or sputtering; this layer acted as the cathode for electrodeposition of a shell of nickel or copper that was 100 μm thick. The polymers were removed by burning them out at 400°C in air, or by dissolving them with a tetrahydrofuran solution of tetrabutylammonium fluoride. Studies of heat dissipation showed that the nickel heat exchangers with features that range in size from 150-750 μm have thermal resistances ranging from 0.07 to 0.12°-2 C W-1 cm at flow rates of water of ~20 L h-1 and pressures of 8.6-83×103 N m-2
  • Keywords
    cooling; electrodeposition; heat exchangers; micromechanical devices; moulding; photolithography; thermal resistance; 150 to 750 micron; 300 to 700 micron; 400 degC; 8.6 to 83E3 N/m2; Cu; Ni; electrodeposition; epoxy; flow rates; heat dissipation; metallic heat exchangers; microembossing; poly(dimethylsiloxane); poly(methyl methacrylate); polyurethane; replica molding; sacrificial polymer mandrils; soft lithographic techniques; sputtering; tetrabutylammonium fluoride; thermal evaporation; thermal resistances; Copper; Micromachining; Nickel; Optical device fabrication; Polymers; Resistance heating; Soft lithography; Soldering; Sputtering; Water heating;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/84.911098
  • Filename
    911098