Title :
Proton-induced dielectric breakdown of power MOSFETs
Author :
Titus, J.L. ; Wheatley, C.F.
Author_Institution :
Naval Surface Warfare Centre, Crane, IN, USA
fDate :
12/1/1998 12:00:00 AM
Abstract :
Proton-induced dielectric breakdown of vertical power metal oxide semiconductor field effect transistors (MOSFETs) is reported for the first time and compared to the heavy-ion-induced gate rupture response. Power MOSFETs from five variants were fabricated with nominal gate oxide thicknesses of 30, 50, 70, 100, and 150 nm. Devices from each variant were characterized to several heavy ion beams as previously reported; and then other devices from each variant were subsequently characterized to 200 MeV protons, as reported here. In addition, a limited characterization was performed using 44 MeV protons. Employing a similar test methodology, failure thresholds for the onset of proton-induced dielectric breakdown were determined for each gate oxide variant. The measured proton-induced dielectric breakdown thresholds induced by 200 and 44 MeV protons are compared to the measured heavy-ion induced failure thresholds
Keywords :
dielectric thin films; failure analysis; power MOSFET; proton effects; semiconductor device breakdown; semiconductor device reliability; 30 to 150 nm; characterization; failure thresholds; field effect transistors; heavy-ion-induced gate rupture response; oxide thicknesses; power MOSFET; proton-induced dielectric breakdown; test methodology; vertical power FETs; Atomic layer deposition; Atomic measurements; Capacitors; Dielectric breakdown; Dielectric measurements; Dielectric substrates; FETs; Failure analysis; MOSFETs; Protons;
Journal_Title :
Nuclear Science, IEEE Transactions on