• DocumentCode
    1455784
  • Title

    Integrated optimization capabilities in the VISTA technology CAD framework

  • Author

    Plasun, R. ; Stockinger, M. ; Selberherr, Siegfried

  • Author_Institution
    Inst. for Microelectron., Tech. Univ. of Vienna, Austria
  • Volume
    17
  • Issue
    12
  • fYear
    1998
  • fDate
    12/1/1998 12:00:00 AM
  • Firstpage
    1244
  • Lastpage
    1251
  • Abstract
    Advanced analysis features implemented in the Vienna Integrated System for TCAD Applications simulation environment are presented. These functionalities support automatic experiment generation (design of experiments), model fitting (response surface methodology), optimization, and calibration. They interact with the core modules of the framework supporting the simulation of the manufacturing process and electrical characterization of semiconductor devices. Two examples demonstrate the efficiency of these framework capabilities. The first one shows the optimization of the electrical characteristics of vertical double-diffused metal-oxide-semiconductor (MOS) field-effect transistors. The second example deals with the optimization of analytical doping profiles of MOS transistors
  • Keywords
    MOS integrated circuits; VLSI; circuit optimisation; circuit simulation; design of experiments; doping profiles; integrated circuit design; technology CAD (electronics); VISTA technology CAD framework; Vienna Integrated System for TCAD Applications; analytical doping profiles; automatic experiment generation; calibration; core modules; design of experiments; electrical characterization; integrated optimization capabilities; manufacturing process; model fitting; response surface methodology; simulation environment; vertical double-diffused MOS transistors; Analytical models; Calibration; Design automation; Design optimization; Electric variables; FETs; Manufacturing processes; Response surface methodology; Semiconductor devices; Surface fitting;
  • fLanguage
    English
  • Journal_Title
    Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0070
  • Type

    jour

  • DOI
    10.1109/43.736564
  • Filename
    736564