DocumentCode :
1455937
Title :
New copper cladding method to help relieve metal shortage
Volume :
71
Issue :
2
fYear :
1952
Firstpage :
197
Lastpage :
199
Abstract :
A new process whereby copper is bonded inseparably to steel was demonstrated recently in the metallurgical laboratory of the James H. Herron Company, Cleveland, Ohio. This process produces a bimetal in which the copper is bonded to the steel and may be the answer to the civilian need for the material of a thousand uses-copper.
Keywords :
Cameras; Companies; Copper; Power systems; Production; Steel;
fLanguage :
English
Journal_Title :
Electrical Engineering
Publisher :
ieee
ISSN :
0095-9197
Type :
jour
DOI :
10.1109/EE.1952.6437975
Filename :
6437975
Link To Document :
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