DocumentCode :
14574
Title :
Gate Bias Stress-Induced Threshold Voltage Shift Effect of a-IGZO TFTs with Cu Gate
Author :
Xiang Liu ; Wang, L.L. ; Ce Ning ; Hehe Hu ; Wei Yang ; Ke Wang ; Seong Yeol Yoo ; Shengdong Zhang
Author_Institution :
Inst. of Microelectron., Peking Univ., Beijing, China
Volume :
61
Issue :
12
fYear :
2014
fDate :
Dec. 2014
Firstpage :
4299
Lastpage :
4303
Abstract :
The gate bias stress-induced threshold voltage shift effect of amorphous indium gallium zinc oxide thin-film transistors (a-IGZO TFTs) with Cu gate is investigated in this brief. It is revealed that the Cu-gated TFTs with SiOx gate insulator suffer from serious electrical performance degradation under gate bias stress owing to Cu diffusion into the gate insulator and channel region. A stacked gate insulator of SiOx/SiNx is then proposed to suppress the Cu diffusion. Experimental results show that the Cu-gated TFTs with the stacked gate insulators have a comparable threshold voltage shift effect with that of the conventional TFTs with Mo electrode and SiOx insulator, under both positive and negative gate bias stresses.
Keywords :
amorphous semiconductors; copper; diffusion; gallium compounds; indium compounds; insulating materials; silicon compounds; thin film transistors; zinc compounds; Cu; Cu diffusion; Cu-gated TFT; InGaZnO; SiOx-SiNx; SiOx gate insulator; a-IGZO TFT; amorphous indium gallium zinc oxide thin-film transistors; channel region; electrical performance degradation; gate bias stress-induced threshold voltage shift effect; stacked gate insulator; Insulators; Logic gates; Stress; Thin film transistors; Threshold voltage; Voltage measurement; Amorphous indium gallium zinc oxide thin-film transistors (a-IGZO TFTs); copper diffusion; copper gate; stacked gate insulator; threshold voltage shift; threshold voltage shift.;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2014.2362850
Filename :
6937174
Link To Document :
بازگشت