• DocumentCode
    1458391
  • Title

    Carbon Nanomaterials: The Ideal Interconnect Technology for Next-Generation ICs

  • Author

    Li, Hong ; Xu, Chuan ; Banerjee, Kaustav

  • Author_Institution
    Univ. of California, Santa Barbara, CA, USA
  • Volume
    27
  • Issue
    4
  • fYear
    2010
  • Firstpage
    20
  • Lastpage
    31
  • Abstract
    Carbon nanotubes and graphene nanoribbons are two promising next-generation interconnect technologies. Electrical modeling and performance analysis have demonstrated the superiority of these emerging technologies compared to conventional copper interconnects, as this article explains.
  • Keywords
    carbon nanotubes; integrated circuits; microprocessor chips; performance evaluation; carbon nanomaterials; carbon nanotubes; copper interconnection; electrical performance analysis; graphene nanoribbons; next-generation IC; technology interconnection; RF or wireless interconnects; carbon nanomaterials; carbon nanotube (CNT); delay; design and test; electrical interconnects; graphene nanoribbon (GNR); on-chip vias; optical interconnects; power; through-silicon vias (TSVs);
  • fLanguage
    English
  • Journal_Title
    Design & Test of Computers, IEEE
  • Publisher
    ieee
  • ISSN
    0740-7475
  • Type

    jour

  • DOI
    10.1109/MDT.2010.55
  • Filename
    5440143
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1458391