• DocumentCode
    1459074
  • Title

    Built-up Mica plate for high-temperature applications

  • Author

    Dawes, C. L.

  • Author_Institution
    Harvard University, Cambridge, Mass., and New England Mica Company, Waltham, Mass.
  • Volume
    72
  • Issue
    2
  • fYear
    1953
  • Firstpage
    145
  • Lastpage
    150
  • Abstract
    Certain developments in the field of built-up bonded mica products for use as electrical insulation are described with emphasis placed on high-temperature applications.
  • Keywords
    Conductivity; Humidity; Insulation; Leakage current; Metals; Resistance; Temperature measurement;
  • fLanguage
    English
  • Journal_Title
    Electrical Engineering
  • Publisher
    ieee
  • ISSN
    0095-9197
  • Type

    jour

  • DOI
    10.1109/EE.1953.6438494
  • Filename
    6438494
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1459074