DocumentCode
1459297
Title
Fin- and Island-Isolated AlGaN/GaN HFETs
Author
Valizadeh, Pouya ; AlOtaibi, Bandar
Author_Institution
Dept. of Electr. & Comput. Eng., Concordia Univ., Montreal, QC, Canada
Volume
58
Issue
5
fYear
2011
fDate
5/1/2011 12:00:00 AM
Firstpage
1404
Lastpage
1407
Abstract
The effects of the variation of the size of isolation mesa of AlGaN/GaN heterojunction field-effect transistors (HFETs) on the device characteristics are presented for the first time. Studies on the direct current and pulsed drain and gate current-voltage characteristics demonstrate a correlation between the pinchoff voltage and the size of the isolation mesa. In this paper, devices fabricated on narrow mesas (i.e., 16 × 40 μm2 fins) and also a device fabricated on an array of very small size mesas (i.e., 16 × 7 μm2 islands) are compared with AlGaN/GaN HFETs of traditionally sized mesas (i.e., 70 × 100 μm2). All these devices show maximum extrinsic gate transconductance greater than 220 mS/mm, whereas the pinchoff voltage is observed to become less negative by reducing the size of the individual mesas. The island-isolated HFETs also enjoy a relatively higher gate transconductance.
Keywords
III-V semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; wide band gap semiconductors; AlGaN-GaN; direct current; fin-island-isolated HFET; gate current-voltage characteristics; heterojunction field-effect transistors; isolation mesa; maximum extrinsic gate transconductance; pinchoff voltage; pulsed drain; Aluminum gallium nitride; Gallium nitride; HEMTs; Logic gates; MODFETs; Stress; Transconductance; AlGaN/GaN heterojunction field-effect transistor (HFET); fin isolation; island isolation; strain engineering;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2011.2109961
Filename
5720301
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