DocumentCode
145982
Title
How chips helped discover the Higgs boson at CERN
Author
Snoeys, W.
Author_Institution
PH-ESE-ME, CERN, Geneva, Switzerland
fYear
2014
fDate
22-26 Sept. 2014
Firstpage
9
Lastpage
19
Abstract
Integrated circuits and devices revolutionized particle physics experiments, and have been a cornerstone in the recent discovery of the Higgs boson by the ATLAS and CMS experiments at the Large Hadron Collider at CERN. Particles are accelerated and brought into collision at specific interaction points. Detectors are giant cameras, about 40 m long by 20 m in diameter, constructed around these interaction points to take pictures of collision products as they fly away from the collision point. They contain millions of channels, often implemented as reverse biased silicon pin diode arrays covering areas of up to 200 m2 in the center of the experiment, generating a small (~1fC) electric charge upon particle traversals. Integrated circuits provide the readout, and accept collision rates of about 40 MHz with on-line selection of potentially interesting events before data storage. Power consumption directly impacts the measurement quality as it governs the amount of material present in the detector. Radiation tolerance has to exceed space requirements by orders of magnitude. The presence of tens of thousands of chips in a single system requires special attention to uniformity, robustness and redundancy.
Keywords
Higgs bosons; nuclear electronics; p-i-n diodes; silicon radiation detectors; ATLAS experiments; CERN; CMS experiments; Higgs boson; Large Hadron Collider; collision rates; electric charge; integrated circuits; particle physics experiments; radiation tolerance; reverse biased silicon pin diode arrays; Acceleration; CMOS integrated circuits; Detectors; Large Hadron Collider; Timing; Transistors; charge sensitive readout; particle detection; silicon pin diodes;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid State Device Research Conference (ESSDERC), 2014 44th European
Conference_Location
Venice
ISSN
1930-8876
Print_ISBN
978-1-4799-4378-4
Type
conf
DOI
10.1109/ESSDERC.2014.6948747
Filename
6948747
Link To Document