DocumentCode
1460013
Title
Evolutionary Path Planning With Subpath Constraints
Author
Gyorfi, Julius S. ; Gamota, Daniel R. ; Mok, Swee Mean ; Szczech, John B. ; Toloo, Mansour ; Zhang, Jie
Author_Institution
Appl. Res. Center, Motorola, Inc., Schaumburg, IL, USA
Volume
33
Issue
2
fYear
2010
fDate
4/1/2010 12:00:00 AM
Firstpage
143
Lastpage
151
Abstract
We develop an evolutionary method of planning paths that are subject to subpath constraints. These constraints can include subpaths that must be incorporated into the solution path, path intersection restrictions, and obstacle avoidance. Our method involves two stages. In the first stage, a global solution is found without consideration of any obstacles. In the second stage, local planning is performed to modify the global path to avoid obstacles. Stage one involves a fixed-length chromosome formulation of a genetic algorithm that utilizes existing operators and a new subpath reversal operator. Stage two involves a graph search process. Our algorithm is applicable to the field of printed electronics where continuous-spray processes are used to deposit electrically functional material onto flexible substrates. These processes give rise to the kinds of subpath constraints we have investigated. We evaluate our algorithm by applying it to a representative problem in the printed electronics field.
Keywords
collision avoidance; electronic engineering computing; genetic algorithms; graph theory; path planning; printed circuit manufacture; printed circuits; continuous-spray processes; electrically functional material; evolutionary path planning; fixed-length chromosome formulation; flexible substrates; genetic algorithm; graph search process; obstacle avoidance; path intersection restrictions; printed electronics; solution path; subpath constraints; Atomic layer deposition; Biological cells; Genetic algorithms; Joining processes; Manufacturing processes; Mobile robots; Optimization methods; Path planning; Printing; Spraying; Genetic algorithms; optimization methods; path planning; printed electronics;
fLanguage
English
Journal_Title
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
1521-334X
Type
jour
DOI
10.1109/TEPM.2010.2046327
Filename
5441192
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