• DocumentCode
    146026
  • Title

    Hole mobility in InSb-based devices: Dependency on surface orientation, body thickness and strain

  • Author

    Pengying Chang ; Lang Zeng ; Xiaoyan Liu ; Gang Du

  • Author_Institution
    Sch. of Electron. & Comput. Eng., Peking Univ., Shenzhen, China
  • fYear
    2014
  • fDate
    22-26 Sept. 2014
  • Firstpage
    122
  • Lastpage
    125
  • Abstract
    This work presents an investigation on hole mobility in InSb-based ultra-thin body (UTB) devices with arbitrary surface orientation, body thickness and biaxial strain. The anisotropic band structures with quantum confinement are computed using a fully self-consistent solver for six-band k·p Schrödinger and Poisson equations. Hole mobility is computed using the Kubo-Greenwood formalism accounting for nonpolar acoustic and optical phonons, polar optical phonons and surface roughness scattering. The models are calibrated by fitting the experimental data. Our results suggest that for TB<;10nm, mobility trend with surface orientation and channel directions for InSb devices is: (110)/[T10]>(111)>(110)/[001]>(001), where devices with (111) have more excellent behavior than for Si. In addition, biaxial compressive strain introduces maximum mobility gain in the (110)/[110] case. Nevertheless, (110)/[110] is the optimal surface and channel direction for InSb-based UTB devices, followed by (111) orientation.
  • Keywords
    III-V semiconductors; Poisson equation; Schrodinger equation; band structure; hole mobility; indium compounds; surface roughness; InSb; Kubo-Greenwood formalism; Poisson equations; Schrödinger equations; UTB devices; anisotropic band structures; arbitrary surface orientation; biaxial compressive strain; biaxial strain; body thickness; channel direction; hole mobility; maximum mobility gain; nonpolar acoustic; optimal surface; polar optical phonons; quantum confinement; self-consistent solver; surface roughness scattering; ultra-thin body devices; Effective mass; MOSFET; Phonons; Rough surfaces; Scattering; Silicon; Strain;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid State Device Research Conference (ESSDERC), 2014 44th European
  • Conference_Location
    Venice
  • ISSN
    1930-8876
  • Print_ISBN
    978-1-4799-4378-4
  • Type

    conf

  • DOI
    10.1109/ESSDERC.2014.6948773
  • Filename
    6948773