DocumentCode :
1460273
Title :
Compact 60-GHz IPD-Based Branch-Line Coupler for System-on-Package V-Band Radios
Author :
Haroun, Ibrahim ; Plett, Calvin ; Hsu, Yuan-Chia ; Chang, Da-Chiang
Author_Institution :
Commun. Res. Centre, Ottawa, ON, Canada
Volume :
2
Issue :
7
fYear :
2012
fDate :
7/1/2012 12:00:00 AM
Firstpage :
1070
Lastpage :
1074
Abstract :
A compact 60-GHz band branch-line coupler using cpacitively loaded lower-ground coplanar-waveguide (LG-CPW) lines has been successfully demonstrated in a glass-substrate integrated passive device technology. The fabricated coupler has a size reduction of more than 83% compared to that of a conventional CPW branch-line coupler. The capacitive loading is achieved by utilizing the signal layer and the LG of the LG-CPW structure to form microstrip open-circuited stubs. The measured results show a phase error of less than 0.5° between the coupler´s output ports and an amplitude imbalance of less than 1.2 dB over the frequency band 57-64 GHz. The measurements also show that both the return loss and isolation are better than 25 dB at 60 GHz and better than 15 dB over the 57-64-GHz band. The proposed coupler is well suited for low-cost high-performance system-on-package V-band radio front ends for high data rate applications.
Keywords :
coplanar transmission lines; coplanar waveguides; microstrip lines; millimetre wave couplers; radio equipment; system-on-package; waveguide couplers; LG-CPW structure; amplitude imbalance; compact 60-GHz IPD-based branch-line coupler; coupler output port; cpacitively loaded lower-ground coplanar-waveguide; frequency 60 GHz; frequency band; glass-substrate integrated passive device technology; isolation; low-cost high-performance system-on-package V-band radio; microstrip open-circuited stub; phase error; return loss; signal layer; Coplanar waveguides; Couplers; Educational institutions; Frequency measurement; Loss measurement; Microstrip; Power transmission lines; 60-GHz band; branch-line coupler; coplanar-waveguide (CPW) transmission lines; integrated passive device (IPD) technology; system-on-package (SoP);
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2012.2186450
Filename :
6161611
Link To Document :
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