Title :
Novel AlInN/GaN integrated circuits operating up to 500 °C
Author :
Gaska, R. ; Gaevski, M. ; Deng, Jiansong ; Jain, R. ; Simin, G. ; Shur, M.
Author_Institution :
Sensor Electron. Technol., Inc., Columbia, SC, USA
Abstract :
High-temperature technology platform has been developed based on AlInN/GaN heterostructures. High electron concentration in 2DEG channel of AlInN/GaN devices is remarkably stable over a broad temperature range, enabling device operation above 500 °C. The developed IC technology is based on three key elements: (1) exceptional quality AlInN/GaN heterostructure with very high carrier concentration and mobility that enables IC fast operation in a broad temperature range; (2) heterostructure field effect transistor approach that provides fully planar IC structure which is easy to scale and to combine with the other high temperature electronic components; (3) fabrication advancements including novel metallization scheme and high-k passivation/gate dielectrics, specifically developed for high temperature operation. The feasibility of the technology was demonstrated by fabrication and testing inverter and differential amplifier ICs using AlInN/GaN heterostructures. At temperature exceeding 500°C, the developed ICs show stable performance with unit-gain bandwidth above 1 MHz and internal response time 45 ns*.
Keywords :
III-V semiconductors; carrier density; carrier mobility; differential amplifiers; field effect transistors; high-k dielectric thin films; high-temperature electronics; passivation; wide band gap semiconductors; 2DEG channel; AlInN-GaN; carrier concentration; carrier mobility; differential amplifier IC; heterostructure field effect transistor; high electron concentration; high temperature electronic components; high-k passivation/gate dielectrics; high-temperature technology; integrated circuits; Gallium nitride; HEMTs; Integrated circuits; MODFETs; Temperature distribution; Temperature measurement;
Conference_Titel :
Solid State Device Research Conference (ESSDERC), 2014 44th European
Conference_Location :
Venice
Print_ISBN :
978-1-4799-4378-4
DOI :
10.1109/ESSDERC.2014.6948778