Freeform and flexible electronics manufacturing using R2R printing and hybrid integration techniques

Printed electronics and other large-area roll-roll - compatible processes are opening up the new opportunity for cost-efficient mass manufacturing of electronics among other functionalities, on large-area and flexible substrates such as plastic, paper, metal foils, glass and fabrics. Data processing power and other functionalities still require high performance microelectronics circuits and therefore, also traditional electronic/semiconductor technology are also needed. These needs lead to technical manufacturing requirements that can be fulfilled best with concept of utilization combination of printed electronics and hybrid integration of silicon electronics to flexible printed platforms. Extending the continuous roll-to-roll manufacturing approach as far as possible (in air or/and in vacuum) in the manufacturing process to assembly and bonding, the manual assembly and handling phases can be almost fully eliminated. In this paper recent development to manufacture freeform and flexible electronics components and systems using printing and hybrid integration processes is presented. Production examples of hybrid integration will be presented for 1) LED display, 2) a large area roll-to-roll processed LED luminaire, 3) over-moulded optical touch panel and 4) over-moulded OLED subassembly.