DocumentCode :
1460927
Title :
Electromagnetic and structural analyses of an integrated launch package
Author :
Liu, H.-P. ; Ting, Y.L. ; Zowarka, R.C. ; Alexander, A.
Author_Institution :
Center for Electromech., Texas Univ., Austin, TX, USA
Volume :
35
Issue :
1
fYear :
1999
fDate :
1/1/1999 12:00:00 AM
Firstpage :
74
Lastpage :
78
Abstract :
In this paper, detailed three-dimensional (3D) transient electromagnetic (EM) analyses with temperature-dependent material properties were performed using a state-of-the-art analysis tool to calculate current densities, body force densities, and temperature distribution in launch package and rail conductors. The body force densities, temperature distribution, and package accelerations generated by the EM model were then provided to a 3D multiple-step nonlinear static structural model for detailed mechanical analyses. The combined 3D EM and structural analyses can be used to accurately predict the EM launching performance and launch package structural integrity. Furthermore, armature optimization and package survivability enhancement can also be achieved with the help of these analyses
Keywords :
current density; electromagnetic fields; railguns; temperature distribution; transient analysis; 3D multiple-step nonlinear static structural model; 3D transient electromagnetic analyses; EM launching performance; EM model; armature optimization; body force densities; current densities calculation; electromagnetic analyses; integrated launch package; launch package; launch package structural integrity; mechanical analyses; package accelerations; package survivability enhancement; rail conductors; railgun; state-of-the-art analysis tool; structural analyses; temperature distribution; temperature-dependent material properties; Current density; Electromagnetic analysis; Electromagnetic forces; Electromagnetic launching; Electromagnetic transients; Material properties; Packaging; Performance analysis; Temperature distribution; Transient analysis;
fLanguage :
English
Journal_Title :
Magnetics, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9464
Type :
jour
DOI :
10.1109/20.738379
Filename :
738379
Link To Document :
بازگشت