DocumentCode :
1461254
Title :
Testing ICs: getting to the core of the problem
Author :
Murray, Brian T. ; Hayes, John P.
Author_Institution :
Gen. Motors R&D Center, USA
Volume :
29
Issue :
11
fYear :
1996
fDate :
11/1/1996 12:00:00 AM
Firstpage :
32
Lastpage :
38
Abstract :
The article examines the market and technology trends affecting the testing of integrated circuits, with emphasis on the role of predesigned components-cores-and built in self test. We explain manufacturing testing, as opposed to design testing, which happens before manufacturing, and online testing, which happens after
Keywords :
built-in self test; computer testing; integrated circuit manufacture; integrated circuit testing; IC testing; built in self test; cores; integrated circuits; manufacturing testing; online testing; predesigned components; technology trends; Circuit faults; Circuit testing; Combinational circuits; Error correction; Fault detection; Pins; Semiconductor impurities; Sequential analysis; Sequential circuits; Signal processing;
fLanguage :
English
Journal_Title :
Computer
Publisher :
ieee
ISSN :
0018-9162
Type :
jour
DOI :
10.1109/2.544235
Filename :
544235
Link To Document :
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