• DocumentCode
    1461322
  • Title

    Correlation Between Oxide Trap Generation and Negative-Bias Temperature Instability

  • Author

    Boo, A.A. ; Ang, D.S. ; Teo, Z.Q. ; Leong, K.C.

  • Author_Institution
    Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore
  • Volume
    33
  • Issue
    4
  • fYear
    2012
  • fDate
    4/1/2012 12:00:00 AM
  • Firstpage
    486
  • Lastpage
    488
  • Abstract
    Evidence shows that substantial interface degradation under negative-bias temperature (NBT) stressing does not result in any apparent oxide trap generation. The link between NBT instability and oxide trap generation is actually found in the recoverable hole-trapping component (R) of the former. When R is constant, independent of the number of stress/relaxation cycles, no apparent oxide trap generation is observed in spite of nonnegligible interface degradation. However, when oxide trap generation occurs, a correlated decrease of R is observed. Analysis shows that the generated oxide traps are due to a portion of the trapped holes being transformed into a more permanent form. A possible explanation based on the oxygen vacancy defect is given.
  • Keywords
    MOSFET; electric breakdown; leakage currents; semiconductor device reliability; temperature; MOSFET; NBT instability; negative-bias temperature instability; negative-bias temperature stressing; nonnegligible interface degradation; oxide trap generation; oxygen vacancy defect; recoverable hole-trapping component; stress-relaxation cycles; substantial interface degradation; trapped holes; Correlation; Degradation; Leakage current; Logic gates; MOSFET circuits; Silicon; Stress; Bias temperature instability; MOSFET; defect relaxation; oxynitride; stress-induced leakage current (SILC); time-dependent dielectric breakdown;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2012.2185481
  • Filename
    6163333