Title :
Special issue on advanced modeling of power devices and their applications
fDate :
3/1/2012 12:00:00 AM
Abstract :
Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers.
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
DOI :
10.1109/TDMR.2012.2188922
