Title :
A Comprehensive LER-Aware TDDB Lifetime Model for Advanced Cu Interconnects
Author :
Stucchi, Michele ; Roussel, Philippe J. ; Tökei, Zsolt ; Demuynck, Steven ; Groeseneken, Guido
Author_Institution :
IMEC, Leuven, Belgium
fDate :
6/1/2011 12:00:00 AM
Abstract :
A time-dependent dielectric breakdown (TDDB) lifetime model predicting the impact of line-edge roughness (LER) on Cu interconnect reliability is proposed. The structure, validity, and accuracy of the model are evaluated and discussed. The model is applied to an interconnect scaling scenario that includes conventional patterning and spacer-defined patterning of nanometer-scale Cu wires. LER-aware TDDB lifetime predictions are obtained from the model, and consequent recommendations on how to improve the TDDB lifetime of future interconnects are derived.
Keywords :
copper; electric breakdown; integrated circuit interconnections; integrated circuit reliability; nanowires; Cu; copper interconnects; interconnect scaling; line-edge roughness; nanometer-scale wires; reliability; spacer-defined patterning; time-dependent dielectric breakdown lifetime model; Approximation methods; Copper; Dielectrics; Fitting; Predictive models; Reliability; Wires; Cu interconnects; lifetime prediction; line-edge roughness (LER); time-dependent dielectric breakdown (TDDB);
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
DOI :
10.1109/TDMR.2011.2121909
