DocumentCode
146246
Title
Run-time voltage detection circuit for 3-D IC power delivery
Author
Pathak, Divya ; Savidis, Ioannis
Author_Institution
Dept. of Electr. & Comput. Eng., Drexel Univ., Philadelphia, PA, USA
fYear
2014
fDate
2-5 Sept. 2014
Firstpage
183
Lastpage
187
Abstract
An advantage of 3-D integrated circuits is the possibility to integrate heterogeneous technologies on separate device planes. The device planes are fabricated in different technologies operating at distinct power supply voltages. A mechanism to detect and set the power supply voltage of each domain within each device plane of a 3-D IC is described. The detection of the power supply voltage is achieved through the placement of a ring oscillator circuit in each voltage domain. The current is supplied at the set voltage to the device plane through dedicated power modules comprising of a frequency to voltage converter and a dependent voltage source placed on a dedicated power plane. The functionality of the supply voltage detection and delivery circuits is verified through SPICE simulation of the device plane (22 nm technology) and power plane (45 nm technology). The implementation of the proposed circuits for 3-D IC design facilitate a plug-and-play approach for the integration of heterogeneous technologies.
Keywords
detector circuits; integrated circuit design; integrated circuit interconnections; power supply circuits; three-dimensional integrated circuits; voltage-frequency convertors; 3D IC power delivery; 3D integrated circuits; SPICE simulation; delivery circuits; dependent voltage source; device planes; frequency to voltage converter; heterogeneous technologies; plug-and-play approach; power modules; power plane; power supply voltages; ring oscillator circuit; supply voltage detection; voltage domain; CMOS integrated circuits; 3-D integration; IC power delivery; heterogeneous circuits; voltage detection;
fLanguage
English
Publisher
ieee
Conference_Titel
System-on-Chip Conference (SOCC), 2014 27th IEEE International
Conference_Location
Las Vegas, NV
Type
conf
DOI
10.1109/SOCC.2014.6948923
Filename
6948923
Link To Document