DocumentCode :
146261
Title :
An all-digital on-chip abnormal temperature warning sensor for dynamic thermal management
Author :
Ching-Che Chung ; Jhih-Wei Li
Author_Institution :
Dept. of Comput. Sci. & Inf. Eng., Nat. Chung Cheng Univ., Chiayi, Taiwan
fYear :
2014
fDate :
2-5 Sept. 2014
Firstpage :
221
Lastpage :
224
Abstract :
In this paper, an all-digital on-chip abnormal temperature warning sensor (ATWS) which can tolerate process and voltage variations after four-point calibration is presented. The proposed ATWS uses the delay ratios among three ring oscillators to build up a relative reference modeling (RRM) temperature sensor. Then the process variations can be eliminated after four-point calibration. In addition, the operational voltage can be estimated by the RRM. Thus, the proposed ATWS can use a linear model to compute the chip temperature even with voltage variations. The proposed ATWS is implemented in a 90nm CMOS process, and the active area is 0.0625mm2. It can achieve temperature error smaller than ±3.66°C within the range of 40°C to 70°C, and 0.9V to 1.1V. The power consumption is 530μW at 4k sample/s.
Keywords :
CMOS integrated circuits; calibration; delay circuits; measurement errors; oscillators; system-on-chip; temperature measurement; temperature sensors; thermal management (packaging); ATWS; CMOS process; RRM temperature sensor; all digital on-chip abnormal temperature warning sensor; delay ratio; dynamic thermal management; four point calibration; linear model; operational voltage estimation; power 530 muW; relative reference modeling; ring oscillator; size 90 nm; temperature 40 degC to 70 degC; temperature error; voltage 0.9 V to 1.1 V; voltage variations; Calibration; Delays; Ring oscillators; System-on-chip; Temperature sensors; Thermal management; Calibration; circuit reliability; delay circuits; dynamic thermal management; relative reference modeling; sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
System-on-Chip Conference (SOCC), 2014 27th IEEE International
Conference_Location :
Las Vegas, NV
Type :
conf
DOI :
10.1109/SOCC.2014.6948931
Filename :
6948931
Link To Document :
بازگشت