DocumentCode :
1462615
Title :
Correlation Between TDDB and VRDB for Low- k Dielectrics With Square Root E Model
Author :
Lin, Mingte ; Su, K.C.
Author_Institution :
United Microelectron. Corp., Hsinchu, Taiwan
Volume :
31
Issue :
5
fYear :
2010
fDate :
5/1/2010 12:00:00 AM
Firstpage :
494
Lastpage :
496
Abstract :
A concise relation between voltage ramp dielectric breakdown (VRDB) and time-dependent dielectric breakdown (TDDB) based on the square-root (SQRT) E model for low- k dielectric-reliability evaluation was established. VRDB and TDDB experiments on low- k dielectrics in Cu interconnects were conducted and showed a very well correlation by this relation. The electric field acceleration parameter of the SQRT E model can be estimated with the dual ramping rate VRDB test. The characteristic of the statistic distribution of VRDB is shown to relate to that of TDDB.
Keywords :
copper; integrated circuit interconnections; low-k dielectric thin films; semiconductor device breakdown; semiconductor device reliability; statistical distributions; Cu; Cu interconnects; SQRT E model; TDDB experiment; VRDB experiment; dual ramping rate; electric field acceleration parameter; low-k dielectric reliability evaluation; square-root E model; statistic distribution; time-dependent dielectric breakdown; voltage ramp dielectric breakdown; Dielectrics; low-$k$; time-dependent dielectric breakdown (TDDB); voltage ramp dielectric breakdown (VRDB);
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2010.2044554
Filename :
5443502
Link To Document :
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