Cost-optimal design of wireless pre-bonding test framework

In a three-dimensional stacked IC (3D-SIC), pre-bonding die tests are performed to test different functional components on dies as the yield of 3D-SIC highly depends on the quality of dies used for stacking. In observing the test challenges in pre-bonding, contactless wireless probing using inductive coupling has been introduced to provide high bandwidth test data transfer without the stress-induced damage. Aiming at high bandwidth high parallel pre-bonding test, a hybrid wireless test framework is established in this paper by utilizing such wireless probing techniques. Under the hybrid test framework, both IP cores and embedded TSVs are tested concurrently by applying scan methodology and BIST respectively. To exploit the performance-cost effectiveness of our new architecture, a test scheduling scheme is thereby proposed to optimize the test resource distribution and minimize test application time. The simulation study demonstrates the wireless test capability and the feasibility of a hybrid wireless test infrastructure.