DocumentCode :
146338
Title :
Comparative study of FinFETs versus 22nm bulk CMOS technologies: SRAM design perspective
Author :
Farkhani, Hooman ; Peiravi, Ali ; Kargaard, Jens Madsen ; Moradi, Farshad
Author_Institution :
Ferdowsi Univ. of Mashhad, Mashhad, Iran
fYear :
2014
fDate :
2-5 Sept. 2014
Firstpage :
449
Lastpage :
454
Abstract :
In this paper, FinFET devices are compared to bulk CMOS technology by looking at the characteristics of both devices and their challenges in nano-scale regimes. The effects of process variations on these devices along with the effect of device parameters on their characteristics are explored. Both FinFET and CMOS devices are used in 6T and 8T-SRAM cells. Simulation results show significant improvements for FinFET-based SRAMs compared to bulk CMOS-based SRAM cells. FinFET based 6T-SRAM cell shows 39% improvement in read static noise margin, 54% higher write margin, 54% smaller minimum supply voltage applicable, and 7.3X less leakage power compared to its CMOS counterpart. 8T-SRAM using FinFET improved read static noise margin, write margin, minimum supply voltage and leakage power consumption by 7%, 64%, 50%, and 3.1X compared to bulk-CMOS 8T-SRAM, respectively.
Keywords :
CMOS memory circuits; MOSFET circuits; SRAM chips; logic design; 6T SRAM cells; 8T-SRAM cells; CMOS devices; FinFET devices; FinFET-based SRAM; SRAM design perspective; bulk CMOS technologies; bulk CMOS-based SRAM cells; device parameters; leakage power consumption; nanoscale regimes; process variations; read static noise margin; size 22 nm; supply voltage; write margin; CMOS integrated circuits; FinFETs; Logic gates; Power demand; SRAM cells; Threshold voltage; CMOS; FinFET; SRAM;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
System-on-Chip Conference (SOCC), 2014 27th IEEE International
Conference_Location :
Las Vegas, NV
Type :
conf
DOI :
10.1109/SOCC.2014.6948971
Filename :
6948971
Link To Document :
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