Solder joint reliability of flip chip and plastic ball grid array assemblies under thermal, mechanical, and vibrational conditions

Author

Lau, John H.

Author_Institution

Express Packaging Syst., Palo Alto, CA, USA

Volume

19

Issue

4

fYear

1996

fDate

11/1/1996 12:00:00 AM

Firstpage

728

Lastpage

735

Abstract

The thermal, mechanical, and vibrational responses of flip chip and plastic ball grid array (PBGA) solder joints have been determined in this study. The effects of overload environmental stress factors on the mechanical responses of the solder joints have been determined by bending and twisting experiments. The effects of shipping environmental stress factors on the vibrational responses of the solder joints have been determined by out-of-plane vibration experiments. Also, the thermal fatigue behavior of solder joints have been investigated by nonlinear finite element (FE), Coffin-Manson, and fracture mechanics methods

Keywords

bending; environmental degradation; finite element analysis; flip-chip devices; fracture mechanics; integrated circuit packaging; integrated circuit reliability; soldering; thermal stress cracking; vibrations; Coffin-Manson methods; PBGA; bending experiments; flip chip assemblies; fracture mechanics methods; mechanical conditions; nonlinear FEM; out-of-plane vibration experiments; overload environmental stress factors; plastic BGA assemblies; plastic ball grid array; shipping environmental stress factors; solder joint reliability; thermal conditions; thermal fatigue behavior; twisting experiments; vibrational conditions; Assembly; Electronics packaging; Fatigue; Flip chip; Integrated circuit interconnections; Plastics; Silicon; Soldering; Thermal stresses; Vibrations;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1070-9894

Type

jour

DOI

10.1109/96.544363

Filename

544363