A new anisotropic conductive film with arrayed conductive particles

Author

Ishibashi, Kazuo ; Kimura, Jun

Author_Institution

AMP Technol. Japan Ltd., Kanagawa, Japan

Volume

19

Issue

4

fYear

1996

fDate

11/1/1996 12:00:00 AM

Firstpage

752

Lastpage

757

Abstract

A new anisotropic conductive film (ACF) incorporating arrayed metal conductors in an adhesive polymer film is proposed. A photoresist pattern with a number of round holes arrayed in triangular arrangement is formed on a stainless steel substrate. The holes are then electroplated to form metal bumps, using the substrate as a cathode. After removal of the photoresist, the substrate is laminated with a solid adhesive film. Finally, the ACF of arrayed metal bumps is obtained when the adhesive film is peeled off and the metal bumps are transferred from the substrate to the adhesive film. The superior interconnection properties of the proposed ACF, compared with conventional ACFs that rely on randomly distributed conductive particles, are attributed to the arrayed, uniformly sized particles in the adhesive film

Keywords

adhesion; conducting materials; electroplated coatings; integrated circuit interconnections; photoresists; polymer films; adhesive polymer film; anisotropic conductive film; arrayed metal particles; electroplating; interconnection; metal bumps; photoresist; stainless steel substrate; Anisotropic conductive films; Anisotropic magnetoresistance; Conductive films; Electrodes; Integrated circuit interconnections; LAN interconnection; Polymer films; Resists; Steel; Substrates;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1070-9894

Type

jour

DOI

10.1109/96.544366

Filename

544366