An integrated micro cooling system for electronic circuits

Author

Schütze, Jörg ; Ilgen, Herman ; Fahrner, Wolfgang R.

Author_Institution

ILFA GmbH, Kesseisdorf, Germany

Volume

48

Issue

2

fYear

2001

fDate

4/1/2001 12:00:00 AM

Firstpage

281

Lastpage

285

Abstract

A fully FR4-compatible integrated cooling system has been developed. Cooling channels have been etched into a thick copper layer to form microchannels. The structure is reinforced by two prepreg layers toward the component and solder side. Several cooling channels can be independently run. The heat dissipation capability of the system is 20 W per channel (and heat source). Typical coolants are water or methoxynonafluorobutane. For an outlet to inlet temperature difference of 25°C and a power dissipation of 30 W, a (water) flow rate of 20 ml/min is required. Pressure losses are below 300 mbar (for water)

Keywords

cooling; printed circuits; 20 W; 25 C; 30 W; FR4-compatible integrated cooling system; FR4-epoxy; coolants; cooling channels; electronic circuits; heat dissipation capability; heat source; integrated micro cooling system; methoxynonafluorobutane; microchannels; outlet to inlet temperature difference; power dissipation; prepreg layers; pressure losses; printed circuit boards; solder side; thick copper layer; water; Bonding; Coolants; Copper; Electronic circuits; Electronics cooling; Etching; Heat sinks; Logic arrays; Manufacturing; Microchannel;

fLanguage

English

Journal_Title

Industrial Electronics, IEEE Transactions on

Publisher

ieee

ISSN

0278-0046

Type

jour

DOI

10.1109/41.915406

Filename

915406