Micro thermal management of high-power diode laser bars

Author

Lorenzen, Dirk ; Bonhaus, Jörg ; Fahrner, Wolfgang R. ; Kaulfersch, Eberhard ; Wörner, Eckhard ; Koidl, Peter ; Unger, Katrin ; Müller, Dietmar ; Rölke, Stefan ; Schmidt, Herbert ; Grellmann, Michael

Author_Institution

Jenoptik Laserdiode GmbH, Jena, Germany

Volume

48

Issue

2

fYear

2001

fDate

4/1/2001 12:00:00 AM

Firstpage

286

Lastpage

297

Abstract

Lifetime and reliability of high-power diode laser bars are sensitively related to operating temperature, mounting stress, and solder electromigration. These three factors have been taken into account for the development of a new packaging technology for 1 cm laser bars of gallium arsenide. We examine the use of chemical-vapor-deposited (CVD) diamond as heatspreaders in order to reduce thermal resistance of a microchannel cooler for liquid cooling. We show that it is possible to perform hard soldering on a CVD-diamond with a new technique. Additionally, we present a controlled water cooling system fit to the flow characteristics of the cooler. It permits one to adjust the emission wavelength of the diode lasers by changing the water flux

Keywords

CVD coatings; III-V semiconductors; brazing; diamond; gallium arsenide; laser reliability; semiconductor lasers; temperature control; thermal management (packaging); thermal resistance; CVD diamond; GaAs; chemical-vapor-deposited diamond; controlled water cooling system; emission wavelength adjustment; gallium arsenide; hard soldering; heatspreaders; high-power diode laser bars; lifetime; liquid cooling; micro thermal management; microchannel cooler; mounting stress; operating temperature; packaging; packaging technology; reliability; solder electromigration; temperature control; thermal resistance reduction; thermoelasticity; water flux; Bars; Chemical lasers; Chemical technology; Diode lasers; Electromigration; Packaging; Temperature sensors; Thermal management; Thermal resistance; Thermal stresses;

fLanguage

English

Journal_Title

Industrial Electronics, IEEE Transactions on

Publisher

ieee

ISSN

0278-0046

Type

jour

DOI

10.1109/41.915407

Filename

915407