• DocumentCode
    1463914
  • Title

    SiC devices for advanced power and high-temperature applications

  • Author

    Wondrak, Wolfgang ; Held, Raban ; Niemann, Ekkehard ; Schmid, Ulrich

  • Author_Institution
    Res. & Technol., DaimlerCrystal AG, Frankfurt on Main, Germany
  • Volume
    48
  • Issue
    2
  • fYear
    2001
  • fDate
    4/1/2001 12:00:00 AM
  • Firstpage
    307
  • Lastpage
    308
  • Abstract
    Silicon carbide (SiC) process technology has made rapid progress, resulting in the realization of very promising electronic devices and sensors, enabling advanced solutions in power industry and mobile systems. In particular, for electronics working under harsh environmental conditions, SiC devices reach unprecedented performance. Transfer to production has already started for some applications
  • Keywords
    MIS devices; power semiconductor devices; semiconductor materials; silicon compounds; SiC; SiC power electronic devices; advanced power applications; harsh environmental conditions; high-temperature applications; mobile systems; power industry; sensors; Chemical sensors; Insulated gate bipolar transistors; Intelligent sensors; Power electronics; Schottky diodes; Semiconductor diodes; Silicon carbide; Switching loss; Temperature sensors; Thermal conductivity;
  • fLanguage
    English
  • Journal_Title
    Industrial Electronics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0046
  • Type

    jour

  • DOI
    10.1109/41.915409
  • Filename
    915409