DocumentCode
1464014
Title
Computing inductive noise of CMOS drivers
Author
Rainal, A.J.
Author_Institution
Lucent Technol., Bell Labs., Murray Hill, NJ, USA
Volume
19
Issue
4
fYear
1996
fDate
11/1/1996 12:00:00 AM
Firstpage
789
Lastpage
802
Abstract
The inductive noise (i.e., ΔI noise, simultaneous switching noise, or ground bounce) developed between the ground plane in the chip and the ground plane in the printed wiring board (PWB) seriously limits the number of on-chip drivers or bits that can be switched simultaneously in the same direction. This is especially the case for the ubiquitous complementary metal-oxide-semiconductor (CMOS) technology, which now forms the basis of VLSI. This paper presents a new electrical model for computing inductive noise associated with CMOS technology. The model is especially useful for computing inductive noise during chip-to-chip communication when n CMOS drivers are switched in the same direction at an arbitrary, monotonic set of times {t1=0, t2, t3, ···, tn} to form controlled skewing sequences
Keywords
CMOS integrated circuits; VLSI; driver circuits; integrated circuit modelling; integrated circuit noise; CMOS driver; VLSI; chip-to-chip communication; electrical model; ground bounce; inductive noise; simultaneous switching noise; skewing sequence; Artificial intelligence; CMOS technology; Crosstalk; Electronics packaging; Noise reduction; Pervasive computing; Semiconductor device modeling; Switches; Very large scale integration; Wiring;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1070-9894
Type
jour
DOI
10.1109/96.544371
Filename
544371
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