• DocumentCode
    1464014
  • Title

    Computing inductive noise of CMOS drivers

  • Author

    Rainal, A.J.

  • Author_Institution
    Lucent Technol., Bell Labs., Murray Hill, NJ, USA
  • Volume
    19
  • Issue
    4
  • fYear
    1996
  • fDate
    11/1/1996 12:00:00 AM
  • Firstpage
    789
  • Lastpage
    802
  • Abstract
    The inductive noise (i.e., ΔI noise, simultaneous switching noise, or ground bounce) developed between the ground plane in the chip and the ground plane in the printed wiring board (PWB) seriously limits the number of on-chip drivers or bits that can be switched simultaneously in the same direction. This is especially the case for the ubiquitous complementary metal-oxide-semiconductor (CMOS) technology, which now forms the basis of VLSI. This paper presents a new electrical model for computing inductive noise associated with CMOS technology. The model is especially useful for computing inductive noise during chip-to-chip communication when n CMOS drivers are switched in the same direction at an arbitrary, monotonic set of times {t1=0, t2, t3, ···, tn} to form controlled skewing sequences
  • Keywords
    CMOS integrated circuits; VLSI; driver circuits; integrated circuit modelling; integrated circuit noise; CMOS driver; VLSI; chip-to-chip communication; electrical model; ground bounce; inductive noise; simultaneous switching noise; skewing sequence; Artificial intelligence; CMOS technology; Crosstalk; Electronics packaging; Noise reduction; Pervasive computing; Semiconductor device modeling; Switches; Very large scale integration; Wiring;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9894
  • Type

    jour

  • DOI
    10.1109/96.544371
  • Filename
    544371