Title :
Computing inductive noise of CMOS drivers
Author_Institution :
Lucent Technol., Bell Labs., Murray Hill, NJ, USA
fDate :
11/1/1996 12:00:00 AM
Abstract :
The inductive noise (i.e., ΔI noise, simultaneous switching noise, or ground bounce) developed between the ground plane in the chip and the ground plane in the printed wiring board (PWB) seriously limits the number of on-chip drivers or bits that can be switched simultaneously in the same direction. This is especially the case for the ubiquitous complementary metal-oxide-semiconductor (CMOS) technology, which now forms the basis of VLSI. This paper presents a new electrical model for computing inductive noise associated with CMOS technology. The model is especially useful for computing inductive noise during chip-to-chip communication when n CMOS drivers are switched in the same direction at an arbitrary, monotonic set of times {t1=0, t2, t3, ···, tn} to form controlled skewing sequences
Keywords :
CMOS integrated circuits; VLSI; driver circuits; integrated circuit modelling; integrated circuit noise; CMOS driver; VLSI; chip-to-chip communication; electrical model; ground bounce; inductive noise; simultaneous switching noise; skewing sequence; Artificial intelligence; CMOS technology; Crosstalk; Electronics packaging; Noise reduction; Pervasive computing; Semiconductor device modeling; Switches; Very large scale integration; Wiring;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on