Title :
Characterization of Copper Electromigration Dependence on Selective Chemical Vapor Deposited Cobalt Capping Layer Thickness
Author :
Yang, C. -C ; Baumann, F. ; Wang, P.-C. ; Lee, SY ; Ma, P. ; AuBuchon, J. ; Edelstein, D.
Author_Institution :
IBM Res., Yorktown Heights, NY, USA
fDate :
4/1/2011 12:00:00 AM
Abstract :
Co films with various thicknesses were selectively deposited as Cu capping layers by chemical-vapor-deposition technique. Selectivity of the Co deposition between Cu and dielectric surfaces was improved by raising the deposition pressure. Degree of electromigration (EM) resistance enhancement was observed to be dependent on the deposited Co thickness. Compared to the no-Co control, significant EM lifetime enhancement was observed when the Co cap is thicker than 6 nm.
Keywords :
chemical vapour deposition; cobalt; copper; electromigration; metallic thin films; Co; Cu; capping layers; chemical vapor deposition; dielectric surfaces; electromigration lifetime enhancement; electromigration resistance enhancement; films; Copper; Dielectrics; Electromigration; Oxidation; Resistance; Surface treatment; Chemical vapor deposition; Cobalt; reliability;
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/LED.2011.2108260
