Title :
Improved IC Production Yield by Taking Into Account the Electromagnetic Interference Level During Testing
Author :
Hu, Cheng-Nan ; Ko, Hsuan-Chung
Author_Institution :
Dept. of Commun. Eng., Oriental Inst. of Technol., Taipei, Taiwan
fDate :
5/1/2011 12:00:00 AM
Abstract :
This paper presents a novel method for detecting test errors in radio frequency integrated circuit (RFIC) autotest-equipment (ATE) caused by electromagnetic interferences. A sensor for measuring ambient electromagnetic (EM) signals was used to determine whether interference was the cause of the reported testing error. Upon detecting a testing error, a retest procedure was actuated to recover the testing error and to improve yield loss. For theoretical validation, Monte Carlo procedure was applied in a “source-path-victim” model to simulate the effect of electromagnetic interference (EMI) on RFIC measurement. Finally, a four-element dual-band antenna array design printed onto an ATE load board is proposed. Both the numerical and measurement results validate the effectiveness of the proposed method in reducing testing errors caused by interference.
Keywords :
Monte Carlo methods; antenna arrays; automatic test equipment; electromagnetic interference; integrated circuit measurement; integrated circuit testing; multifrequency antennas; radiofrequency integrated circuits; sensors; ATE load board; IC production yield; Monte Carlo procedure; RFIC; RFIC measurement; ambient electromagnetic signal; autotest-equipment; electromagnetic interference level; four-element dual-band antenna array design; radio frequency integrated circuit; sensor; source-path-victim model; test error detection; Bit error rate; Electromagnetic interference; Noise; Radiofrequency integrated circuits; Receivers; Antenna measurements; communication channels; communication system; electromagnetic analysis; electromagnetic compatibility; electromagnetic coupling; electromagnetic interference (EMI); electromagnetic radiative interference; electromagnetic shielding; electronic equipment; yield estimation;
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
DOI :
10.1109/TEMC.2011.2106133